Vertiv (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, today made another key addition to its industry-leading thermal management portfolio, with the introduction of the Vertiv™ CoolLoop Trim Cooler, in support of air and liquid cooling applications for AI (artificial intelligence) and HPC (high-performance computing). This global solution supports diverse climate conditions for hybrid-cooled or liquid-cooled data centres and AI factories.
Integrating seamlessly with high-density, liquid-cooled environments, the Vertiv CoolLoop Trim Cooler delivers operational efficiency and aligns with the industry’s evolving needs for energy-efficient and compact cooling solutions. It provides up to a 70% reduction in annual cooling energy consumption leveraging free-cooling and mechanical operation, and 40% space savings compared to traditional systems. Designed to address the challenges of modern AI factories, the system supports fluctuating supply water temperatures up to 40°C and cold plate functionality at 45°C.
Straightforward water connections provide smooth and direct system integration for the Vertiv CoolLoop Trim Cooler and the Vertiv™ CoolChip CDU coolant distribution units, for direct-to-chip cooling. Vertiv CoolLoop Trim Cooler can also connect directly to immersion cooling systems. This simplifies installation and operational complexity, allowing compatibility across a range of high-density cooling environments, offering time savings and cost efficiencies for customers.
“AI is dramatically changing the cooling profiles of today’s data centres, requiring innovative approaches to managing the thermal challenges inherent in 100kW+ racks,” said Sam Bainborough, vice president, thermal business EMEA at Vertiv. “Today’s announcement, and the ongoing expansion of Vertiv’s industry-leading high-density thermal management portfolio, allow us to deliver pioneering, future-ready liquid cooling and chilled water solutions to meet our customers’ AI-driven demands.”
The Vertiv™ CoolLoop Trim Cooler uses low-GWP refrigerant and offers a scalable cooling capacity up to almost 3 MW in the air-cooled configuration. With free cooling coils optimized for high ambient temperatures, the system is designed to operate in free cooling mode across more seasons and conditions, for reduced electrical consumption and CO2e emissions. It is compliant with 2027 EU F-GAS regulations ban, avoiding the need for costly redesigns or infrastructure upgrades to meet this upcoming regulatory requirement.
For more information on the Vertiv CoolLoop Trim Cooler, Vertiv CoolChip CDU family or other Vertiv solutions to enable AI acceleration, visit Vertiv.com.
